Analysis of the Multidimensional Properties of Polysilazane

Polysilazane (PSZ), an organic-inorganic hybrid material, demonstrates irreplaceable application value in high-temperature ceramics and protective coatings due to its unique molecular structure. Its core properties stem from its backbone structure, which features alternating silicon (Si) and nitrogen (N) atoms, endowing the material with multiple performance advantages.

‌1. High-Temperature Stability and Ceramic Conversion Capability‌

Polysilazane can be converted into SiCN or Si3N4 ceramics by heat treatment above 800°C in an inert atmosphere or an ammonia atmosphere. During this process, the material shrinkage is less than 5%, significantly superior to that of traditional polymer precursors, enabling the fabrication of complex ceramic components. For example, in aircraft engine blade coatings, polysilazane-derived ceramic layers can withstand short-term thermal shock at 1600°C, improving thermal shock resistance by over 30%.

‌2. Molecular Designability for Modulating Interfacial Properties‌

By introducing organic groups such as phenyl and vinyl groups, the hydrophobicity, adhesion, and curing behavior of polysilazane can be precisely tuned. Experiments have shown that a polysilazane coating containing 20% ​​phenyl groups can achieve a contact angle of up to 115° and salt spray resistance exceeding 5.000 hours, making it particularly suitable for corrosion protection of marine equipment. Furthermore, its low viscosity (approximately 50-200 mPa·s at 25°C) allows for a variety of processing methods, including spin coating and dipping.

3. Chemical Reactivity and Functionalization

The Si-H and N-H bonds within the molecular chain impart controllable crosslinking capabilities to the material. Under the influence of UV light or a catalyst, polysilazane can achieve gradient curing, forming a dense three-dimensional network structure. This property has been used to modify lithium-ion battery separators. The treated separators have increased their ionic conductivity to 1.2×10⁻³ S/cm and reduced their thermal shrinkage (at 200°C/1h) from 15% to below 3%.

Currently, with the combination of atomic layer deposition (ALD) technology and polysilazane modification, it is opening up new application scenarios in emerging fields such as quantum dot encapsulation and flexible electronics, and continuously promoting technological innovation of high-performance materials.